UNITED STATES, January 2, 2024 /EINPresswire / -- The "Diamond Wire Wafer Slicing Machine market" research report 2023-2030 includes an in-depth analysis of the market by focusing information on ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

Video Credit: PI (Physik Instrumente) LP Traditionally, slicing SiC ingots into wafers involves diamond- or slurry-based wire sawing processes, resulting in significant kerf-loss of valuable material ...

Despite their attractive properties for the semiconductor industry, the applications of diamonds are limited due to the lack of techniques to slice them into thin wafers efficiently. As a result, ...

The introduction of diamond wire allows faster wafer slicing and hence higher productivity. Higher conversion efficiency and productivity translate into lower cost per watt. The innovations are ...

Professor Hidai remarked how slicing diamonds with a laser "enables the production of high-quality wafers at a low cost" and is indispensable for fabricating diamond semiconductor devices.

In this regard, Prof. Hidai remarks: “Diamond slicing enables the production of high-quality wafers at low cost and is indispensable to fabricate diamond semiconductor devices. Therefore ...