With the three-dimensional architecture of FinFET devices, new simulation approaches are being used to model thermal behavior of the die in order to see localized temperature variations. Chip designs ...
Cadence was presented awards for three different categories including awards for analog/mixed signal IP, 16nm FinFET design infrastructure, and 3D-IC design solutions. The awards underscore the deep ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback