the finished wafer is diced into individual chips. The die is assembled into a package type and then tested. In this case, the die sort process takes place after the dicing step. In WLPs, though, die ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D ... Today, flip-chip is still used to make several lower-cost package types, such as ball-grid array (BGA) ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design ... while enabling global resource optimization, chip-package co-design and advanced multiphysics convergence analysis ...

The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality of results (QoR) and 3DIC full flow QC with reference flows for 3Dblox, while enabling global resource ...