The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

For the purposes of illustrating the IC-package co-design flow, we will focus on flip-chip packaging, because of the additional level of complexity associated with it. While wire-bonded packages can ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies. Also announce tool certification for TSMC N3C process and initial ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

Chip Packaging. For a long time, packaging an integrated circuit was just a means to protect the chip, also known as a “die,” by encapsulating it in a supporting case and connecting it to the ...

Qualcomm reportedly sets deal for UMC’s advanced chip packaging tech, challenging TSMC. Now that you have a very brief context, you need to know that, for a long time, ...

WASHINGTON — Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.