Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser ...

However, diamonds aren't easy to work with, as they tend to crack when trying to cut wafers out of them. A new laser-based technique ... have a wider bandgap than silicon. They could theoretically ...

High-precision Laser Wafer Marking technologies are designed for engraving serial numbers and other critical information on silicon and compounds ... CMS Laser’s cutting-edge laser marking ...

While silicon wafers are the workhorse of the semiconductor ... “SiC is a hard, brittle material that is challenging to cut without losing meaningful amounts, and Halo Industries’ proprietary ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

2024 /PRNewswire/ -- Synova S.A., the Swiss-based manufacturer of state-of-the-art water jet laser systems, is delighted to share its advances in wafer edge profiling for silicon carbide (SiC ...

The invention of silicon chips revolutionised communications. Even today they are the cornerstone of the technologies we use to move information around the world. The way they work has changed ...

Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on ... GaAs lasers were grown on industry-standard 300 mm silicon wafers. The trick was to accept the lattice ...