Dialing in nanosecond pulses to cleanly cut silicon wafers. Focused on edge quality, thermal effects, and process repeatability. Putin breaks silence on US bombing of Iran US Massive B-52 Pulls Off ...

laser; Japanese researchers cut semiconductor wafers from diamonds with a new laser technique Diamonds could replace silicon for some hi-tech applications By Alfonso Maruccia August 4, 2023, 9:19 ...

Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser Jury finds MyPillow founder defamed former employee for a leading voting ...

Laser Photonics Corporation (NASDAQ: LASE) (“LPC”), a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired ...

Synova S.A., the Swiss-based manufacturer of state-of-the-art water jet laser systems, is delighted to share its advances in wafer edge profiling for silicon carbide (SiC) wafers. The LCS 305 5 ...

Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. ... This ...

Halo Industries, a California-based startup company with a novel, laser-based, method for producing silicon carbide (SiC) semiconductor wafer substrates, says it has raised $80 million in a series B ...

In sum, the photonic silicon chip is novel because it’s the first demonstration of a fully monolithic laser diode on a silicon wafer of this size. The team’s process is also scalable and cost ...

Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on the silicon die, ... GaAs lasers were grown on industry-standard 300 mm silicon wafers.

For more information about Laser Wafer Marking Systems or LPC’s lines of cleaning, cutting, welding, marking, or engraving laser systems, visit https://www.laserphotonics.com. About Laser ...