Urethane’s properties are vital to high-volume production operations that utilize multi-wire saws to slice wafers as thin as 80-100 microns. Any deviation in wafer thickness or profile will ...

By producing multi wafers using diamond wire saws, the costs per wafer can be reduced significantly, while the environmental impact is far less damaging than using the more conventional slurry ...

You need a special slicing tool to produce paper-thin wafers from silicon blocks ("ingots"): reminiscent of an egg slicer, a filigree wire is used to cut through the ingot at a speed of up to 60 km/h.

Materion Breaks Ground on Multi-Million Dollar Wafer Level Coating Cell Coating Facility for Infrared Wafer Level Products WESTFORD, Mass.--(BUSINESS WIRE)-- Materion Barr Precision Optics & Thin Film ...

MUNICH & DURHAM, N.C.--(BUSINESS WIRE)--Infineon ... silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation ...

SERIS noted that the wide adoption of mc-Si wafer diamond-wire wafer cutting has been limited by existing etching processes being deemed expensive and degrade conversion efficiencies. Reactive ion ...

Silicon wafer maker Green Energy Technology (GET) will reportedly suspend the use of slurry slicing to process ingots into wafers in December 2017, according to industry sources. Save my User ID ...

--(BUSINESS WIRE)-- Materion Barr Precision Optics ... with a semiconductor manufacturing layout to handle 200mm wafers. The multi-million dollar investment will assist in decreasing the cost ...