Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

The Confederation of Indian Industry (CII), in partnership with a consumer packaging company and the Embassy of Finland, has unveiled a roadmap for India's flexible packaging industry. Outlook ...

Simply put: are organic substrates up to the challenge? Fig. 1: The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path to 1µm L/S. Source: Onto ...