The reduced pin count (RPC) DRAM was created to provide IC and ... An alternative to integrating the memory on-chip is to use a separate DRAM IC bare die stacked in a two-die package. Because of the ...

Wide I/O is a memory interface standard for 3D IC produced by JEDEC (JESD229). The basic concept is to use a very large number of pins, each of which is relatively slow but low powered. These concepts ...

Some reworking tasks are more difficult than others though, and we have to admit that lifting an IC pin doesn’t always result in success. But with this video from [Mr. SolderFix] there’s hope ...

Memory chips are expected to show the strongest growth rate among major IC market categories during the next five years with a CAGR of 7.3% to $109.9 billion in 2021 from $77.3 billion in 2016, says ...

Naperville, IL - August 18, 2003 - Tezzaron Semiconductor today announced a prototype memory device with record-breaking speed: 1.3 nanosecond (ns) latency, 1 ns cycle time, and a throughput of 2 ...

the leading embedded non-volatile memory vendor, announces its automotive grade Neobit OTP in 0.25um node passed reliability test in 2010 Q2 and thus prevails to become the first automotive grade OTP ...