Handling small SMT components successfully requires tight process windows. For instance, the current process control for 0402 ... the copper pad (Fig. 2). 2. We recommend using stencils of around ...

The 0402 and 0201 components are in a weird spot, where soldering iron assembly is no longer really viable, but the stencil+reflow approach might not be unilaterally successful when you start off ...

CLEVELAND & DALLAS, April 23, 2025--(BUSINESS WIRE)--Align Capital Partners ("ACP") portfolio company StenTech (the "Company"), a leading provider of surface mount ...