Here’s an LED indicator which was made at home out of a Silicon Carbide (SiC ... This provides a large mounting area that also acts as a heat sink to make sure the LED won’t burn itself ...

PA&E offers engineers the option of using integrated molybdenum/copper heat sinks and now, for applications where weight is a primary consideration, the company is offering an aluminum silicon carbide ...

Thermal design has become a first-order constraint in GaN system performance. As GaN pushes deeper into high-power, ...

Cree, Inc. is introducing the industry's first commercially available silicon carbide (SiC ... 70 percent reduction in the size of the heat sink or a 50 percent increase in power density.

Heatwave metal-matrix composite (MMC) materials use an aluminum matrix with silicon-carbide or silicon-carbide ... values for thermal base plates and heat spreaders. They are lightweight, yet ...

IEEE Spectrum had an interesting read about circuits using silicon carbide as a substrate. [Alan Mantooth] and colleagues say that circuits based on this or some other rugged technology will be ...

A boat made of such composites will not sink despite damage ... economy because of its heat resistance. The magnesium alloy matrix composite is reinforced with silicon carbide hollow particles ...

New research from the Ateneo de Manila University could pave the way for more durable versions of silicon carbide (SiC), a semiconductive ... candidate for use as heat shielding in nuclear ...

The silicon-carbide chip company logged a fiscal fourth-quarter net loss from continuing operations of $113.3 million, or 91 cents a share, compared with a loss of $61.8 million, or 50 cents a ...

The new line consists of silicon and silicon carbide hybrid power ... “A copper baseplate further decreases thermal resistance to the heat sink by 9.3%, ensuring the module remains cool under ...

That's where silicon carbide (silicon mixed with carbon) comes in, since it can better handle higher voltages and heat. The problem, though, is that SiC is a newer semiconductor substrate.