Even single-function devices, though, such as op amps and LDO regulators, are undergoing some serious shrinkage—from leaded dual-inline packages to SOICs to SOT, and below. Traditional packages ...

San Jose, Calif. Avago Technologies has expanded its family of Intelligent Power Modules (IPM) interface optocouplers in a smaller, SO-6 package size. Half the size of standard dual-inline packages, ...

We know that the first commercially important integrated circuits were packaged in the now-familiar dual in-line package (DIP), the little black plastic millipedes that would crawl across circuit ...

Quad-flat no-leads (QFN)), dual in-line package (Plastic Dual Inline Package (PDIP) & Ceramic Dual Inline Package (CDIP)), and others. By industry vertical, the market is studied across consumer ...

Last week, chip manufacturer Zilog announced that after 48 years on the market, its line of standalone DIP (dual inline package) Z80 CPUs is coming to an end, ceasing sales on June 14, 2024.

DIP through-hole chips are an old package with instantly recognizable dual in-line pin rows. Beginners love these chips because they’re large and look easy to solder; we abhor them because we ...

Even single-function devices, though, such as op amps and LDO regulators, are undergoing some serious shrinkage—from leaded dual-inline packages to SOICs to SOT, and below. Traditional packages ...