It’s is one of the first micropower 36-V op amps offered in both a single SOT553 (1.6 × 1.6 mm) package and a dual, very-thin shrink small outline package (VSSOP) (2.0 × 3.1 mm).

San Jose, Calif. — Avago Technologies has expanded its family of Intelligent Power Modules (IPM) interface optocouplers in a smaller, SO-6 package size. Half the size of standard dual-inline packages, ...

As useful and versatile as the DIP was, and for as successful as the package became, its design was anything but obvious. Let’s take a look at the dual in-line package and how it got that way.

Last week, chip manufacturer Zilog announced that after 48 years on the market, its line of standalone DIP (dual inline package) Z80 CPUs is coming to an end, ceasing sales on June 14, 2024.

STMicroelectronics has released the ACEPACK DMT-32 family of silicon carbide (SiC) power modules in a 32-pin, dual-inline, moulded, through-hole package for automotive applications. Targeted at ...

General-purpose analog amplifiers recently developed by FUTEK enable inline amplification for full-bridge, metal-foil strain-gauge-based sensors. The The IAA100 and IAA200 have up to a 10 ...

It’ll come as no surprise to any savvy buyer, and certainly not to any design engineer, that each new generation of electronic products packs more performance into a smaller package than the ...

So now you’re going to tell us what they called the dual-inline ceramic package, right? Report comment. Reply. Sikri says: November 10, 2018 at 3:57 am DIC! Lol. Report comment. Reply.