Ramp – Bring it up to the reflow temperature and let it hang out until all the solder has flowed and the ... These fractures have the potential to break joints or even the components themselves.
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SHENMAO Develops Lead-Free Solder Paste PF606-P for Innovative “Reverse Hybrid” ProcessUsing a SAC reflow profile, this innovative method forms homogeneous solder joints, contrasting with the traditional “LTS Hybrid” assembly, which uses LTS paste and SAC balls under an LTS ...
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