A separate aluminum enclosure was bonded to the copper heat sink, giving [Zach] a place to mount his audio sync and timecode recorder and providing extra thermal mass.

This FAQ will take a few examples to illustrate how thermal interface materials conduct thermal management in power ...

After measuring the three chips with his digital calipers he cut out the footprint he needed, resulting in three smaller heat sinks. We didn’t realize that thermal compound has enough gripping ...

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