From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Chemical Mechanical Planarization is a process of smoothing wafer surface through exerting the chemical and mechanical polishing on wafer. It is an important step in IC fabrication process. To achieve ...

CAD Rendering of the Final Assembly of Project SWCFI (Silicon Wafer Center-Finding Improvement). This project explores improving the inspection process of silicon wafers for quality control in the ...