This technique eliminates the typical kerf-loss associated with wire saws during the ingot-to-wafer slicing process, resulting in a significant yield improvement in SiC wafer production without ...

Korean memory chipmaker SK Hynix has adopted the Metron 3D 300 mm in-line wafer metrology system from Infinitesima. SK Hynix will use the technology in volume production as it provides 3D process ...

Several applications of virtual process modeling and metrology are illustrated in 3D NAND, DRAM, and logic technology. These applications include studies of 3D NAND pillar etch alignment (including ...

The Global Silicon Carbide Ingot Slicing Machine Market reached a value of USD 53.8 million in 2022 and is projected to reach USD 161.2 million by 2032, growing at an annual rate of 11.6% during ...

SHANGRAO, China, April 28, 2024 /PRNewswire/ -- JinkoSolar Holding Co., Ltd. ("JinkoSolar" or the "Company") (NYSE: JKS), one of the largest and most innovative solar module manufacturers in the ...

UNITED STATES, December 15, 2023 /EINPresswire / -- The "Diamond Wire Wafer Slicing Machine market: Forecast (2023-2030) and Insights" research delivers precise global, regional, and country-level ...

Imec is developing a process flow for direct die-to-wafer hybrid bonding at interconnect pad pitches well below 10µm, down to 1µm. To reach these goals, imec achieved a major process improvement, in ...