This advancement paves the way for mass-produced quantum systems—bringing quantum computing, sensing, and communication ...

A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...

In a milestone for scalable quantum technologies, scientists from Boston University, UC Berkeley, and Northwestern University ...

Researchers have developed a material that has never existed before: a stable alloy of carbon, silicon, germanium, and tin.

Fabrication of CMOS image sensors using wafer bonding technologies such as Through Silicon Vias and CuCu hybrid bonding along with their experimental results are discussed. A 2 layer architecture of ...

In a major step toward making quantum technology more practical and scalable, scientists from, UC Berkeley, and Northwestern ...

They created a complementary metal-oxide semiconductor (CMOS) computer—technology at the heart of nearly every modern ...

The journal Nature has published a research paper, "Probing single electrons across 300-mm spin qubit wafers," demonstrating state-of-the-art uniformity, fidelity and measurement statistics of ...

According to the company, this innovation addresses key challenges in scaling quantum computers while also being compatible with existing CMOS manufacturing processes, requiring no new infrastructure.