DALLAS--(BUSINESS WIRE)--Teledyne Micropac, a leader in space-level microcircuit modules and components for mission-critical applications, today debuted a patent-pending, standard 3U VPX card.
This card enables engineers to design high-efficiency, power-dense satellites for Low Earth Orbit (LEO) missions while achieving their safety and performance goals. The new VPX-3U-SP-PSC family of ...