Hybrid bonding’s key process steps include electroplating (electrochemical deposition, ECD), CMP, plasma activation, alignment, bonding, singulation, and annealing. And though these tools are mature, ...

Each time a hybrid bonding process is scaled to a smaller linewidth and pitch, bond strength and alignment must improve. Bond strength needs to be even better, as does the flatness of the wafer, which ...

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...