Today, flip-chip is still used to make several lower-cost package types, such as ball-grid array (BGA) and chip-scale packages (CSPs). “Some are looking for a low-cost packaging solution,” Applied’s ...

Leveraging Menlo’s Ideal Switch technology, the MM5230 RF switch minimizes insertion loss and provides high power handling.

While the metal can version is no longer available, the DIP-8 is still around, as are new surface-mount packages all the way down to the chip-scale. Some vendors have also started making ...

All of these layers communicate electrically, and from the interposer, traffic destined to be exchanged between connected chip packages is transmitted optically ... integrate Ranovus' CPO tech into ...

This integration of optical chiplets within multi-chip packages, increasingly becoming ... Nvidia’s AI computing dominance with its Wafer Scale Engine chip, which it said enables superior ...

MOUNTAIN VIEW, Calif., Feb. 7, 2023-- Synopsys, Inc. (Nasdaq: SNPS) reaches scale for AI-driven chip designs as major semiconductor customers register the first 100 commercial tape-outs with the ...