Electronic Products2d
APEC 2025 delivers big advances in power devices
Power device makers roll out their latest advances at APEC 2025, targeting a range of applications from AI data centers to ...
Compound Semiconductor4d
Nexperia 1200 V SiC MOSFETs now in top-side cooled X.PAK
Nexperia has introduced a range of industrial grade 1200 V SiC MOSFETs in surface-mount (SMD) top-side cooled packaging ...
Electropages4d
New line of angled solderless PCB compression mount connectors launched
The body of these connectors has been thoughtfully designed to enhance the electrical performance over their standard surface mount PCB connectors, enabling edge launch-like performance anywhere on ...
Compound Semiconductor4d
EPC adds next gen 100V GaN FET
GaN specialist Efficient Power Conversion (EPC) has introduced the EPC2367, a next-generation 100 V eGaN FET for power ...
Circuits Assembly Online Magazine2d
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Arizona Expo & Tech Forum
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Arizona Expo & Tech Forum taking ...