LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, that’s starting to be mass-produced.

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

With the fast growth in semiconductor industry, packaging solutions of processor units and application specific integrated circuit (ASIC) devices to meet the needs of advanced Silicon (Si) nodes, ...

I. Abstract This paper will provide an overview of Si based capacitor/IPD integration evolution trends seen in the industry across different package platform, including 2.5D TSI DTC and embedded IPD ...