With major manufacturers racing to make smartphones ever thinner, ways to minimize the size of smartphone components have become increasin ...

LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, that’s starting to be mass-produced.

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

Journal of Colloid and Interface Science (2004). [4] Dynamic flow measurements of capillary underfill through a bump array in flip chip package. Microelectronics Reliability (2010).

Estimated market potential for advanced packaging of more than EUR 69 billion by 2029; 2.5/3D, Flip Chip and System-in-Package are the most commonly used methods ...

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...

In flip-chip packages, the coefficient of thermal expansion (CTE) mismatch between the chip and the substrate is the root cause for reliability issues such as excessive warpage, low-k dielectric layer ...

We report here a successful demonstration of a flip-chip packaging approach for a microelectromechanical systems (MEMS) device with in-plane movable microelectrodes implanted in a rodent brain. The ...