Abstract: We have examined the effect of phosphorus content in the electroless nickel/immersion gold (ENIG) under bump metallurgy and ... the intermetallics formed between Sn-Ag-Cu (lead-free) solder ...

Abstract: We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold.