and your components no longer need to be individually touched with a soldering iron for as many times as they have pads. Plus, it usually goes silky smooth, the process is a joy to witness ...
The current generation of USB-powered soldering irons have a lot going for them, chief among them being portability and automatic start and stop. But an iron that turns off in the middle of ...
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...
A simple process that coats die and wire-bonded lead frames in an adhesion promoter helps ensure long-term reliability and ...
AOS releases state-of-the-art surface mounting package options for its industry-leading high power MOSFET portfolio ...
Of course, Bowflex’s adjustable model costs nearly a third of the Nike bench, which is probably why it feels less solid (it’s ...
This FAQ will take a few examples to illustrate how thermal interface materials conduct thermal management in power ...
The Asus ROG Harpe Ace Mini is a powerful and reasonably discreet mouse, aimed towards gamers who want a sensibly toned-down ...
it may also lead to uneven edges and burrs after soldering.Therefore, you should communicate with the PCB manufacturer and ask it to improve the process, such as using gold plating, OSP and other pad ...
Alpha and Omega Semiconductor (AOS) has introduced two new surface-mount package options for its high-power MOSFET portfolio.
the general diameter of the openings is less than one-third of the size of the pad to ensure that the solder paste can smoothly seep down and cover the pad. Aperture diameter minus the foot diameter, ...
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