The failures, when they do happen, you want them to be in the packaging side, not the die side, because packaging-related failures usually have to do with things like solder voids or like in IGBTs ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

This FAQ will take a few examples to illustrate how thermal interface materials conduct thermal management in power ...

DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025. With a diverse portfolio of advanced circuit materials ...

This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing ...

Key advantages include: High-clarity imaging with advanced defect detection for BGA, QFN, PTH, and solder voids. New Vi5 software integration, featuring real-time visualization, auto contrast, and ...

The technique ensures precise and uniform bonding by using advanced software and feedback sensors. A new patented approach to ...

This design makes a number of modifications to hardware, as such is not recommended for those not comfortable with a soldering iron. Warranties may be void. I am not responsible for any damages that ...

Portable Convenience: This cordless soldering iron set is USB rechargeable, making it ideal for on-the-go repairs and DIY projects. Adjustable Temperature Control: Equipped with a 3-speed ...

STEUBENVILLE, Ohio — On Ohio 7 through Steubenville, there have been two voids found underneath the pavement -- one in the southbound shoulder and another in the northbound driving lane.