ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

Lam Research's AI-powered Dextro cobot targets fab inefficiencies, aiming to drive CSBG growth and expand margins through automation.

However, hybrid bonding will likely remain a post-back-end-of-line process within wafer and system foundries due to its sensitivity to particulates and specificities of CMP and surface conditioning,” ...

Lam Research bets on CSBG's steady revenues and Semiverse's innovation to offset cyclicality and outpace rivals in chipmaking.

Effects of air flow on droplet removal from wafer were investigated as the fundamental study of CMP cleaning. Deformation and movement of droplet on wafer by air flow were visualized by a high speed ...

The purpose of this paper is to investigate the effect of diamond grit during chemical mechanical polishing (CMP) process. CMP is the most important for planarization of wafer surface in semiconductor ...