In the closing stages, Calibre 3DStress performs rigorous sign-off analysis, ensuring that all assembly elements meet ...

An IC package provides the electrical, thermal, and mechanical transition from the semiconductor die or chip to the circuit board, which is often called a motherboard.

The Global Advanced IC Substrate Market 2025-2035 report provides an in-depth analysis of the rapidly evolving advanced IC substrate industry from 2025 to 2035.

However, these approaches can present significant challenges for IC test, since most legacy IC test approaches are based on conventional two-dimensional processes. To address these challenges, Siemens ...

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated ...

As it is becoming much more difficult and expensive to pack more transistors into a single chip, the chip industry pins its hope on chiplet technology when the global demand for HPC is growing.

The Dimensity 9400 to have the biggest die size in a smartphone chip. By Chandan Pandit. April 09, 2024. MediaTek’s flagship chipsets are becoming increasingly popular for their value proposition.

ROHM’s latest product builds on the 1st generation MUS-IC BD34301EKV audio DAC chip, renowned for its sound quality and widely adopted in high-end models from various companies.