Abstract: The present work focused on the effect of MoO/sub 3/ addition on the sintering behaviors and the magnetic properties of NiCuZn ferrite for multilayer chip inductor. It was found that MoO/sub ...

The race for 3D chip packaging tech is getting even fiercer as shrinking chips becomes increasingly challenging. SK Hynix’s crosstown rival, Samsung Electronics Co., is also working on 3D chip ...

Laser frequency combs are light sources that produce evenly spaced, sharp lines across the spectrum, resembling the teeth of ...