News

Excellence in tight spaces: HUBER+SUHNER launches high performance VITA 67.3 RF interconnect portfolio
HUBER+SUHNER is proud to introduce an all-new VITA 67.3 interconnect portfolio designed for use with its proprietary ...
The Fast Mode5h
Next-Gen RF Performance: HUBER+SUHNER Launches VITA 67.3 Interconnect Portfolio
With the launch of the HUBER+SUHNER VITA 67.3 interconnect portfolio , engineers now have access to high-performance coaxial ...
HUBER+SUHNER AG: Excellence in tight spaces: HUBER+SUHNER launches high performance VITA 67.3 RF interconnect portfolio
HUBER+SUHNER is proud to introduce an all-new VITA 67.3 interconnect portfolio designed for use with its proprietary ...
Taiwan News23h
Taiwan's printed circuit board output strong as AI drives demand
TAIPEI (Taiwan News) — Taiwan’s printed circuit board industry is tightening capital spending for a third year but output ...
New White Paper Outlines Proven Methodology for High-Bandwidth Switch Fabric SoC Success
As data centers continue to scale to meet the demands of high-bandwidth streaming, 5G wireless, and IoT connectivity, the complexity of switch fabric System-on-a-Chip (SoC) design has reached ...
CIE – Components in Electronics22h
Nexperia releases ESD protection diodes for 48 V EV communications networks
Nexperia has introduced what it describes as "the industry’s first ESD diodes designed to protect 48 V automotive data ...
IEEE12h
High bandwidth low power interposer interconnect challenge, design, and validation in 3D silicon stacked interconnect (SSI) technology - IEEE Xplore
This paper describes the characteristics of interposer interconnects in 3D silicon stacked interconnect (SSI) technology in comparison to traditional silicon interconnects. It explores unique near end ...