Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

A report titled “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)” was published by researchers at SEMI and the University of California Los Angeles (UCLA)’s ...

The Confederation of Indian Industry (CII), in partnership with a consumer packaging company and the Embassy of Finland, has unveiled a roadmap for India's flexible packaging industry. Outlook ...